The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2010

Filed:

Mar. 02, 2006
Applicants:

Yoshiharu Itahana, Chiyoda-ku, JP;

Junji Nakamura, Chiyoda-ku, JP;

Akio Sawabe, Chiyoda-ku, JP;

Inventors:

Yoshiharu Itahana, Chiyoda-ku, JP;

Junji Nakamura, Chiyoda-ku, JP;

Akio Sawabe, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A ceramic circuit substrate and a manufacturing method thereof are provided, which has excellent thermal shock tolerance by forming a gap between a circuit pattern section and a ceramic substrate, and has a capability of preventing etchant residue from remaining therein. The ceramic circuit substrate according to the present invention includes patterns of brazing material (and) formed on the ceramic substrate, and a circuit pattern section jointed to the patterns of brazing material. The patterns of brazing material includes a line pattern along the edge of the circuit pattern. Also, a gap is formed within the line pattern located between the ceramic substrate and the circuit pattern.


Find Patent Forward Citations

Loading…