The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Mar. 26, 2008
Applicants:
Osamu Kusumoto, Hyogo, JP;
Chiaki Kudou, Hyogo, JP;
Kunimasa Takahashi, Hyogo, JP;
Inventors:
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/425 (2006.01); H01L 21/265 (2006.01); B05C 13/00 (2006.01); B05C 13/02 (2006.01); B05C 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
On one face of a semiconductor waferhaving a first face (principal face)and a second face (rear face), a protection filmis formed. When allowing the semiconductor waferto be attracted onto an attracting face of an electrostatic chuckwhich is heated to 400° C. or more, the semiconductor waferis attracted onto the attracting face via the protection filmWhile heating the semiconductor waferto 400° C. or more, an ion implantation is performed for the face of the semiconductor waferon which the protection filmis not formed. Thereafter, the protection filmis removed from the semiconductor wafer