The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Aug. 17, 2009
Kuo-yuan Lee, Kaohsiung, TW;
Yung-hsiang Chen, Kaohsiung, TW;
Kuo-Yuan Lee, Kaohsiung, TW;
Yung-Hsiang Chen, Kaohsiung, TW;
Walton Advanced Engineering Inc., Kaohsiung, TW;
Abstract
A method for cutting and molding in small windows of a window-type semiconductor package and the semiconductor package fabricated from the same are revealed. According to the method, a substrate strip has a plurality of small windows disposed at the sides or at the corners of the substrate strip. The external surface of the substrate strip includes a plurality of window molding areas surrounding the small windows and extending to the scribe lines. A plurality of chips are disposed on the substrate strip. Then, an encapsulant is formed in the small windows to encapsulate the electrical connecting components and formed on the window molding areas so that the encapsulant extends to the scribe lines. Therefore, the mold flashes at the small windows can be effectively reduced. Additionally, the encapsulant on the window molding areas is cut when singulating the substrate units so that the adhesion area of the encapsulant to the substrate strip is increased to prevent the delamination of traces and solder mask of the substrate units.