The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Aug. 23, 2007
Jeffrey Gerard Hershberger, Shaker Heights, OH (US);
Richard F. Hill, Parkman, OH (US);
Richard I. Roser, Bellmawr, NJ (US);
Jeffrey Gerard Hershberger, Shaker Heights, OH (US);
Richard F. Hill, Parkman, OH (US);
Richard I. Roser, Bellmawr, NJ (US);
Laird Technologies, Inc., Chesterfield, MO (US);
Abstract
In one exemplary embodiment, an assembly includes one or more thermoelectric modules, a compliant thermal interface, and a heat spreader. The compliant thermal interface is configured such that it may substantially conform against and intimately thermally contact an outer surface of a fluid conduit. The heat spreader is disposed generally between and thermally coupled to the compliant thermal interface and the one or more thermoelectric modules. The heat spreader may have greater flexibility than the one or more thermoelectric modules. The heat spreader may also have a thermal conductivity greater than the compliant thermal interface. The assembly may have sufficient flexibility to be circumferentially wrapped at least partially around a portion of the fluid conduit's outer surface, with the compliant thermal interface in substantial conformance against and in intimate thermal contact with the fluid conduit's outer surface portion. Accordingly, a thermally-conducting heat path may thus be established from the fluid conduit to the one or more thermoelectric modules via the compliant thermal interface and the heat spreader.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile