The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
May. 09, 2006
Sidney B. Rigg, Meridian, ID (US);
Charles M. Watkins, Eagle, ID (US);
Kyle K. Kirby, Boise, ID (US);
Peter A. Benson, Boise, ID (US);
Salman Akram, Boise, ID (US);
Sidney B. Rigg, Meridian, ID (US);
Charles M. Watkins, Eagle, ID (US);
Kyle K. Kirby, Boise, ID (US);
Peter A. Benson, Boise, ID (US);
Salman Akram, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one embodiment, a method includes forming a bond-pad on a die having an integrated circuit, the bond-pad being electrically coupled to the integrated circuit. A conductive line is then formed on the die, the conductive line having a first end portion attached to the bond-pad and a second end portion spaced apart from the bond-pad. The method can further include forming a via or passage through the die, the bond-pad, and the first end portion of the conductive line, and depositing an electrically conductive material in at least a portion of the passage to form a conductive interconnect extending at least generally through the microelectronic device.