The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Jan. 14, 2008
Kai Di Feng, Hopewell Junction, NY (US);
Alvin Jose Joseph, Williston, VT (US);
Donald J. Papae, Hopewell Junction, NY (US);
Xiaojin Wei, Fishkill, NY (US);
Kai Di Feng, Hopewell Junction, NY (US);
Alvin Jose Joseph, Williston, VT (US);
Donald J. Papae, Hopewell Junction, NY (US);
Xiaojin Wei, Fishkill, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A system and method in which a semiconductor chip has electrically inactive metal-filled vias adjacent to a semiconductor device or devices to be cooled and the semiconductor device or devices are preferably surrounded by thermally insulating vias. The metal-filled vias are contacted with a thermoelectric cooler to remove excess heat from the semiconductor device or devices.