The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Mar. 27, 2008
Flynn Carson, Redwood City, CA (US);
Jong-woo Ha, Seoul, KR;
Bumjoon Hong, Seoul, KR;
Seongmin Lee, Seoul, KR;
Flynn Carson, Redwood City, CA (US);
Jong-Woo Ha, Seoul, KR;
BumJoon Hong, Seoul, KR;
SeongMin Lee, Seoul, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer, and mounting a top integrated circuit package over the intermediate integrated circuit package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile