The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Mar. 07, 2007
Takeshi Iwamoto, Tokyo, JP;
Kazushi Kono, Tokyo, JP;
Masashi Arakawa, Tokyo, JP;
Toshiaki Yonezu, Tokyo, JP;
Shigeki Obayashi, Tokyo, JP;
Takeshi Iwamoto, Tokyo, JP;
Kazushi Kono, Tokyo, JP;
Masashi Arakawa, Tokyo, JP;
Toshiaki Yonezu, Tokyo, JP;
Shigeki Obayashi, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
Provided is a semiconductor device having an electric fuse structure which receives the supply of an electric current to be permitted to be cut without damaging portions around the fuse. An electric fuse is electrically connected between an electronic circuit and a redundant circuit as a spare of the electronic circuit. After these circuits are sealed with a resin, the fuse can be cut by receiving the supply of an electric current from the outside. The electric fuse is formed in a fine layer, and is made of a main wiring and a barrier film. The linear expansion coefficient of each of the main wiring and the barrier film is larger than that of each of the insulator layers. The melting point of each of the main wiring and the barrier film is lower than that of each of the insulator layers.