The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Jul. 30, 2007
Michael Treu, Villach, AT;
Roland Rupp, Lauf, DE;
Michael Rueb, Faak am See, AT;
Rudolf Elpelt, Brlangen, DE;
Michael Treu, Villach, AT;
Roland Rupp, Lauf, DE;
Michael Rueb, Faak am See, AT;
Rudolf Elpelt, Brlangen, DE;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A method for manufacturing a semiconductor device. The method includes providing a semiconductor body of a conductivity type, wherein the semiconductor body comprises a first surface. At least one buried region of a second conductivity type is formed in the semiconductor body and at least a surface region of the second conductivity type is formed at the first surface of the semiconductor body, wherein the buried region and the surface region are formed such that they are spaced apart from each other. The buried region is formed by deep implantation of a first dopant of the second conductivity type.