The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Dec. 30, 2005
Applicants:
Heeman Choe, The Woodlands, TX (US);
Daewoong Suh, Phoenix, AZ (US);
Inventors:
Heeman Choe, The Woodlands, TX (US);
Daewoong Suh, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 5/18 (2006.01); B23K 35/02 (2006.01); B23K 35/14 (2006.01); B23K 35/22 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.