The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2010

Filed:

Mar. 23, 2007
Applicants:

Paul Stephen Andry, Yorktown Heights, NY (US);

Edmund Juris Sprogis, Underhill, VT (US);

Kenneth Jay Stein, Sandy Hook, CT (US);

Timothy Dooling Sullivan, Underhill, VT (US);

Cornelia Kang-i Tsang, Mohegan Lake, NY (US);

Ping-chuan Wang, Hopewell Junction, NY (US);

Bucknell C. Webb, Yorktown Heights, NY (US);

Inventors:

Paul Stephen Andry, Yorktown Heights, NY (US);

Edmund Juris Sprogis, Underhill, VT (US);

Kenneth Jay Stein, Sandy Hook, CT (US);

Timothy Dooling Sullivan, Underhill, VT (US);

Cornelia Kang-I Tsang, Mohegan Lake, NY (US);

Ping-Chuan Wang, Hopewell Junction, NY (US);

Bucknell C. Webb, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A through-wafer via structure and method for forming the same. The through-wafer via structure includes a wafer having an opening and a top wafer surface. The top wafer surface defines a first reference direction perpendicular to the top wafer surface. The through-wafer via structure further includes a through-wafer via in the opening. The through-wafer via has a shape of a rectangular plate. A height of the through-wafer via in the first reference direction essentially equals a thickness of the wafer in the first reference direction. A length of the through-wafer via in a second reference direction is at least ten times greater than a width of the through-wafer via in a third reference direction. The first, second, and third reference directions are perpendicular to each other.


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