The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2010
Filed:
Jul. 16, 2008
Anil Kumar Chinthakindi, Poughkeepsie, NY (US);
Douglas Duane Coolbaugh, Essex Junction, VT (US);
John Edward Florkey, Pleasant Valley, NY (US);
Jeffrey Peter Gambino, Westford, VT (US);
Zhong-xiang He, Essex Junction, VT (US);
Anthony Kendall Stamper, Williston, VT (US);
Kunal Vaed, Poughkeepsie, NY (US);
Anil Kumar Chinthakindi, Poughkeepsie, NY (US);
Douglas Duane Coolbaugh, Essex Junction, VT (US);
John Edward Florkey, Pleasant Valley, NY (US);
Jeffrey Peter Gambino, Westford, VT (US);
Zhong-Xiang He, Essex Junction, VT (US);
Anthony Kendall Stamper, Williston, VT (US);
Kunal Vaed, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor structure. The semiconductor structure includes: a substrate having a metal wiring level within the substrate; a capping layer on and above a top surface of the substrate; an insulative layer on and above a top surface of the capping layer; an inductor comprising a first portion in and above the insulative layer and a second portion only above the insulative layer; and a wire bond pad within the insulative layer, wherein the first portion the inductor has a height in a first direction greater than a height of the wire bond pad in the first direction, wherein the first direction is perpendicularly directed from the top surface of substrate toward the insulative layer.