The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2010
Filed:
Mar. 26, 2008
Applicants:
Jong-woo Ha, Seoul, KR;
Flynn Carson, Redwood City, CA (US);
Bumjoon Hong, Seoul, KR;
Seongmin Lee, Seoul, KR;
Inventors:
Jong-Woo Ha, Seoul, KR;
Flynn Carson, Redwood City, CA (US);
BumJoon Hong, Seoul, KR;
SeongMin Lee, Seoul, KR;
Assignee:
STATS Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system comprising: providing a module lead array; attaching a module integrated circuit adjacent the module lead array; attaching a module substrate over the module integrated circuit; and applying a module encapsulant over the module integrated circuit wherein the module lead array and the module substrate are partially exposed.