The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2010

Filed:

Nov. 26, 2007
Applicants:

Ralf Otremba, Kaufbeuren, DE;

Xaver Schloegel, Sachsenkam, DE;

Rupert Fischer, Maxhette-Haidhof, DE;

Tien Lai Tan, Melaka, MY;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Xaver Schloegel, Sachsenkam, DE;

Rupert Fischer, Maxhette-Haidhof, DE;

Tien Lai Tan, Melaka, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for making a device is disclosed. One embodiment provides a substrate having a first element protruding from the substrate. A semiconductor chip has a first electrode on a first surface and a second electrode on a second surface opposite to the first surface. The semiconductor chip is placed over the first element of the substrate with the first surface of the semiconductor chip facing the substrate. The second electrode of the semiconductor chip is electrically coupled to the substrate, and the substrate is at least partially removed.


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