The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7723174 B1

PDF
Full Text
Expired
Date of Patent:
May. 25, 2010

Filed:

May. 12, 2009
Applicants:

Andrew Waite, Hopewell Junction, NY (US);

Andy Wei, Dresden, DE;

Gunter Grasshoff, Radebeul, DE;

Inventors:

Andrew Waite, Hopewell Junction, NY (US);

Andy Wei, Dresden, DE;

Gunter Grasshoff, Radebeul, DE;

Assignee:

Globalfoundries Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present disclosure relates to semiconductor devices and a process sequence in which a semiconductor alloy, such as silicon/germanium, may be formed in an early manufacturing stage, wherein other performance-increasing mechanisms, such as a recessed drain and source configuration, possibly in combination with high-k dielectrics and metal gates, may be incorporated in an efficient manner while still maintaining a high degree of compatibility with conventional process techniques.


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