The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Nov. 06, 2007
Tsuneo Torikoshi, Tokyo, JP;
Tsuneo Torikoshi, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A polishing method enables to initiation a second polishing step of a workpiece with an optimal thickness of an uppermost-layer film to be polished. The polishing method comprises: measuring a thickness of an uppermost-layer film, and then carrying out a first polishing step to polish the uppermost-layer film partway and a second polishing step to polish the remaining uppermost-layer film and a next-layer film; determining the polishing rates of the uppermost-layer film in the first and second polishing steps; and measuring a thickness of an uppermost-layer film of a predetermined nth workpiece and setting a processing time for the first polishing step of the nth workpiece or a next predetermined nth workpiece.