The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Sep. 29, 2006
Mitul Modi, Phoenix, AZ (US);
Sudarshan V. Rangaraj, Chandler, AZ (US);
Shankar Ganapathysubramanian, Phoenix, AZ (US);
Richard J. Harries, Chandler, AZ (US);
Sankara J. Subramanian, Chandler, AZ (US);
Mitul Modi, Phoenix, AZ (US);
Sudarshan V. Rangaraj, Chandler, AZ (US);
Shankar Ganapathysubramanian, Phoenix, AZ (US);
Richard J. Harries, Chandler, AZ (US);
Sankara J. Subramanian, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A linear coefficient of thermal expansion (CTE) mismatch between two materials, such as between a microelectronic die and a mounting substrate, may induce stress at the interface of the materials. The temperature changes present during the process of attaching a die to a mounting substrate can cause cracking and failure in the electrical connections used to connect the die and mounting substrate. A material with a CTE approximately matching the die CTE is introduced in the mounting substrate to reduce the stress and cracking at the electrical connections between the die and mounting substrate. Additionally, this material may comprise thin film capacitors useful for decoupling power supplies.