The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
May. 25, 2006
Marc T. Aho, Mountain View, CA (US);
Thaddeus J. Wilson, Sunnyvale, CA (US);
Marc T. Aho, Mountain View, CA (US);
Thaddeus J. Wilson, Sunnyvale, CA (US);
n&k Technology, Inc., San Jose, CA (US);
Abstract
A compact multiple diameter wafer testing device with a footprint of about 33 by 34 inches features on-chuck wafer calibration and integrated cassette-chuck transfer. It includes a five axes wafer handling system, a quick exchange chuck and a fixed through beam sensor fixed. Two of the five axes are provided by an X-Y stage, a third axis is provided by a rotary stage on top of the X-Y stage, a fourth axis belongs to a rotating effector and a fifth axis is provided by motion controlled pin lifters all combined with the X-Y stage. The quick exchange chuck may be easily changed for different wafer diameters and also calibrated by the through beam sensor. The through beam sensor provides on-chuck position calibration of the chucked wafers in conjunction with the X-Y stage and rotary stage. The compact wafer testing device handles wafers between six and twelve inches diameter.