The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2010
Filed:
Oct. 25, 2007
Marvin Raymond Lafontaine, Kingston, NH (US);
Michael Pharand, Chelmsford, MA (US);
Leonard Michael Rubin, S. Hamilton, MA (US);
Klaus Becker, Kensington, NH (US);
Marvin Raymond LaFontaine, Kingston, NH (US);
Michael Pharand, Chelmsford, MA (US);
Leonard Michael Rubin, S. Hamilton, MA (US);
Klaus Becker, Kensington, NH (US);
Axcelis Technologies, Inc., Beverly, MA (US);
Abstract
A method for manufacturing a semiconductor wafer electrostatic clamp, comprising providing a mounting plate, forming an insulative layer on an insulating portion of the mounting plate, forming a first electrode on a first portion of the mounting plate, forming a second electrode on a second portion of the mounting plate, forming a first segment having a first conductivity over the first electrode, forming a first region having a second conductivity over the first segment that creates an n-p type composite, forming a second segment having a third conductivity formed over the over the second electrode, forming a second region having a fourth conductivity formed over the second region that creates an p-n type composite.