The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2010
Filed:
May. 19, 2006
Michael Bauer, Nittendorf, DE;
Thomas Bemmerl, Schwandorf, DE;
Edward Fuergut, Dasing, DE;
Simon Jerebic, Regensburg, DE;
Hermann Vilsmeier, Regensburg, DE;
Michael Bauer, Nittendorf, DE;
Thomas Bemmerl, Schwandorf, DE;
Edward Fuergut, Dasing, DE;
Simon Jerebic, Regensburg, DE;
Hermann Vilsmeier, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
The invention relates to a panel and a semiconductor device including a composite plate with semiconductor chips and a plastic packaging compound, and to processes for producing them. For this purpose, the panel having a composite plate has semiconductor chips arranged in rows and columns on a top side of a wiring substrate. The wiring substrate is covered by a plastic packaging compound in a plurality of semiconductor device positions, the rear sides of the semiconductor chips being fixed on the wiring substrate. A plastic packaging compound in the region of the boundary surfaces with the semiconductor chips has a coefficient of thermal expansion which is matched to that of silicon, while the remaining plastic packaging compound has a coefficient of thermal expansion which is matched to that of the wiring substrate and is therefore correspondingly higher.