The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2010

Filed:

Oct. 23, 2007
Applicants:

Antoine P. Manens, Mountain View, CA (US);

Vladimir Galburt, Campbell, CA (US);

Yan Wang, Sunnyvale, CA (US);

Alain Duboust, Sunnyvale, CA (US);

Donald J. K. Olgado, Palo Alto, CA (US);

Liang-yuh Chen, Foster City, CA (US);

Inventors:

Antoine P. Manens, Mountain View, CA (US);

Vladimir Galburt, Campbell, CA (US);

Yan Wang, Sunnyvale, CA (US);

Alain Duboust, Sunnyvale, CA (US);

Donald J. K. Olgado, Palo Alto, CA (US);

Liang-Yuh Chen, Foster City, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the present invention provide methods of electroprocessing a substrate. One embodiment of the present invention provides a method comprises pressing a substrate against a polishing pad with a force less than about two pounds per square inch, the substrate contacting a first electrode of the polishing pad, applying an electrical bias to the substrate with the first electrode relative to a second electrode of the polishing pad, wherein the second electrode is disposed below the second electrode, and biasing a third electrode disposed in the polishing pad radially outward of the second electrode.


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