The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Jan. 16, 2007
Hsiao-wen Lee, Hsinchu, TW;
Tzu-han Lin, Hsinchu, TW;
Pai-chun Peter Zung, Hsinchu, TW;
Chien-pang Lin, Hsinchu County, TW;
Hsiao-Wen Lee, Hsinchu, TW;
Tzu-Han Lin, Hsinchu, TW;
Pai-Chun Peter Zung, Hsinchu, TW;
Chien-Pang Lin, Hsinchu County, TW;
Visera Technologies, Co., Ltd., Hsin-Chu, TW;
Abstract
An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.