The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2010
Filed:
Sep. 08, 2004
Applicants:
Yukiteru Matsui, Yokohama, JP;
Gaku Minamihaba, Yokohama, JP;
Hiroyuki Yano, Yokohama, JP;
Atsushi Shigeta, Fujisawa, JP;
Inventors:
Yukiteru Matsui, Yokohama, JP;
Gaku Minamihaba, Yokohama, JP;
Hiroyuki Yano, Yokohama, JP;
Atsushi Shigeta, Fujisawa, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a semiconductor device includes depositing a SiOfilm on the substrate having formed thereon a wiring pattern; coating a SOG film on the SiOfilm; and polishing the SOG film using a slurry containing cerium oxide and cationic surfactant with a chemical-mechanical polishing process.