The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Feb. 09, 2009
Woo-seok Ko, Yongin-si, KR;
Yu-sin Yang, Seoul, KR;
Young-jee Yoon, Anyang-si, KR;
Chung-sam Jun, Anyang-si, KR;
Woo-Seok Ko, Yongin-si, KR;
Yu-Sin Yang, Seoul, KR;
Young-Jee Yoon, Anyang-si, KR;
Chung-Sam Jun, Anyang-si, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
A surface inspection apparatus and method increase wafer productivity, wherein to increase an efficiency of the surface inspection apparatus to detect defects during a scanning of the wafer surface, a scanning speed for a subsequent defect detection is varied according to an increase/decrease of defect density represented on a plurality of images acquired successively. When the density of defects is reduced, the scanning speed increases and a level of a skip rule increases, and when the density of defects increases, the scanning speed decreases and a level of the skip rule decreases to precisely detect defects, thereby increasing reliability, throughput, and productivity.