The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2010

Filed:

Nov. 09, 2006
Applicants:

Koichi Hayakawa, Hitachinaka, JP;

Jiro Inoue, Ryugasaki, JP;

Masaaki Nojiri, Hitachinaka, JP;

Inventors:

Koichi Hayakawa, Hitachinaka, JP;

Jiro Inoue, Ryugasaki, JP;

Masaaki Nojiri, Hitachinaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 1/08 (2006.01); H01J 3/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

The via chain conduction failure due to non-conduction caused by insufficient etching in a contact plug/via plug forming process can be detected precisely in a short time. For its achievement, a defect is detected at high speed by taking advantage of characteristics of a potential contrast method using a via chain defect inspection structure and an electron beam defect detection apparatus which can perform continuous inspection while changing an inspection direction without rotating a wafer. Accordingly, the capturing efficiency of a critical electric defect and search efficiency of a defect point can be improved.


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