The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Jan. 05, 2007
Paul Lester, Emmett, ID (US);
Scott Meyer, Boise, ID (US);
Wyland L. Atkins, Kuna, ID (US);
Douglas Richards, Meridian, ID (US);
Constantin Predoaica, Boise, ID (US);
Jeffrey Hudgens, San Francisco, CA (US);
Charles Carlson, Cedar Park, TX (US);
Penchala Kankanala, Santa Clara, CA (US);
Mike Rice, Pleasanton, CA (US);
James S. Papanu, San Rafael, CA (US);
Evanson G. Baiya, Nampa, ID (US);
John J. Rosato, Boise, ID (US);
Paul Lester, Emmett, ID (US);
Scott Meyer, Boise, ID (US);
Wyland L. Atkins, Kuna, ID (US);
Douglas Richards, Meridian, ID (US);
Constantin Predoaica, Boise, ID (US);
Jeffrey Hudgens, San Francisco, CA (US);
Charles Carlson, Cedar Park, TX (US);
Penchala Kankanala, Santa Clara, CA (US);
Mike Rice, Pleasanton, CA (US);
James S. Papanu, San Rafael, CA (US);
Evanson G. Baiya, Nampa, ID (US);
John J. Rosato, Boise, ID (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
The present invention generally provides an apparatus and method for processing and transferring substrates in a multi-chamber processing system that has the capability of receiving and performing single substrate processing steps performed in parallel, while using the many favorable aspects of batch processing. Embodiments of the invention described herein are adapted to maximize system throughput, reduce system cost, reduce cost per substrate during processing, increase system reliability, improve the device yield on the processed substrates, and reduce system footprint. In one embodiment, the cluster tool is adapted to perform a wet/clean process sequence in which various substrate cleaning processes are performed on a substrate in the cluster tool.