The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2010

Filed:

Feb. 16, 2007
Applicants:

Teng-sheng Chen, Hsinchu, TW;

Pai-chun Peter Zung, Hsinchu, TW;

Tzu-han Lin, Hsinchu, TW;

Shin-chang Shiung, Taichung, TW;

Inventors:

Teng-Sheng Chen, Hsinchu, TW;

Pai-Chun Peter Zung, Hsinchu, TW;

Tzu-Han Lin, Hsinchu, TW;

Shin-Chang Shiung, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
Abstract

A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.


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