The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Aug. 31, 2004
Applicants:
Jun He, Portland, OR (US);
Zhiyong MA, Portland, OR (US);
Jose A. Maiz, Portland, OR (US);
Mark Bohr, Aloha, OR (US);
Martin D. Giles, Portland, OR (US);
Guanghai Xu, Portland, OR (US);
Inventors:
Jun He, Portland, OR (US);
Zhiyong Ma, Portland, OR (US);
Jose A. Maiz, Portland, OR (US);
Mark Bohr, Aloha, OR (US);
Martin D. Giles, Portland, OR (US);
Guanghai Xu, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/062 (2006.01); H01L 31/113 (2006.01); H01L 31/119 (2006.01); H01L 23/495 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor substrate having metal oxide semiconductor (MOS) devices, such as an integrated circuit die, is mechanically coupled to a stress structure to apply a stress that improves the performance of at least a portion of the MOS devices on the die.