The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Apr. 22, 2008
Hiroshi Toyoda, Yokohama, JP;
Mitsuhiro Nakao, Yokohama, JP;
Masahiko Hasunuma, Yokohama, JP;
Hisashi Kaneko, Fujisawa, JP;
Atsuko Sakata, Yokohama, JP;
Toshiaki Komukai, Kawasaki, JP;
Hiroshi Toyoda, Yokohama, JP;
Mitsuhiro Nakao, Yokohama, JP;
Masahiko Hasunuma, Yokohama, JP;
Hisashi Kaneko, Fujisawa, JP;
Atsuko Sakata, Yokohama, JP;
Toshiaki Komukai, Kawasaki, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device, which is comprised of a copper wiring layer which is formed above a semiconductor substrate, a pad electrode layer which conducts electrically to the copper wiring layer and has an alloy, which contains copper and a metal whose oxidation tendency is higher than copper, formed to extend to the bottom surface, and an insulating protective film which has an opening extended to the pad electrode layer, is provided.