The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2010
Filed:
Aug. 28, 2006
Hsi-kuei Cheng, Jhbei, TW;
Jung-chih Tsao, Tainan, TW;
Hsien-ping Feng, Youghe, TW;
Ming-yuan Cheng, Taipei, TW;
Steven Lin, Hsinchu, TW;
Ray Chuang, Taipei, TW;
Hsi-Kuei Cheng, Jhbei, TW;
Jung-Chih Tsao, Tainan, TW;
Hsien-Ping Feng, Youghe, TW;
Ming-Yuan Cheng, Taipei, TW;
Steven Lin, Hsinchu, TW;
Ray Chuang, Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
An apparatus and method for preventing the peeling of electroplated metal from a wafer, is disclosed. The apparatus includes a seed layer detector system having a light source and a reflectivity detector. According to the method, the light source emits a beam of light onto a wafer and the reflectivity detector receives the light reflected from the wafer. The reflectivity of the wafer surface is measured to determine the presence or absence of a seed layer on the wafer, as well as whether the seed layer has a minimum thickness for optimum electroplating of a metal onto the seed layer.