The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2010
Filed:
May. 25, 2007
Fumiyuki Osanai, Tokyo, JP;
Atsushi Hiraishi, Tokyo, JP;
Toshio Sugano, Tokyo, JP;
Tsuyoshi Tomoyama, Tokyo, JP;
Satoshi Isa, Tokyo, JP;
Masahiro Yamaguchi, Tokyo, JP;
Masanori Shibamoto, Tokyo, JP;
Fumiyuki Osanai, Tokyo, JP;
Atsushi Hiraishi, Tokyo, JP;
Toshio Sugano, Tokyo, JP;
Tsuyoshi Tomoyama, Tokyo, JP;
Satoshi Isa, Tokyo, JP;
Masahiro Yamaguchi, Tokyo, JP;
Masanori Shibamoto, Tokyo, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
A semiconductor package comprises a substrate, which has two surfaces and comprises first and second electrical paths. On one of the surfaces, a semiconductor chip is mounted. The semiconductor chip comprises a plurality of pads, which include a first pad to be supplied with a power supply and a second pad to be grounded. On the other surface, at least one bypass capacitor is mounted. The bypass capacitor comprises first and second terminals, which are connected to the first and the second pads through the first and the second electrical paths, respectively.