The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2010
Filed:
Jul. 19, 2006
Takashi Noma, Gunma, JP;
Hiroyuki Shinogi, Gunma, JP;
Akira Suzuki, Gunma, JP;
Yoshinori Seki, Gunma, JP;
Koichi Kuhara, Tokyo, JP;
Yukihiro Takao, Gunma, JP;
Hiroshi Yamada, Gunma, JP;
Takashi Noma, Gunma, JP;
Hiroyuki Shinogi, Gunma, JP;
Akira Suzuki, Gunma, JP;
Yoshinori Seki, Gunma, JP;
Koichi Kuhara, Tokyo, JP;
Yukihiro Takao, Gunma, JP;
Hiroshi Yamada, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A glass substrate is bonded through a resin to the top surface of a semiconductor wafer on which a first wiring is formed. A V-shaped groove is formed by notching from the back surface of the wafer. A second wiring connected with the first wiring and extending over the back surface of the wafer is formed. A protection film composed of an organic resin or a photoresist layer to provide protection with an opening is formed on the second wiring by spray coating. A conductive terminal is formed by screen printing using the protection film as a solder mask. A cushioning material may be formed on the back surface of the wafer by spray coating.