The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2010

Filed:

Oct. 01, 2004
Applicants:

Stan D. Tsai, Fremont, CA (US);

Shou-sung Chang, Los Altos, CA (US);

Liang-yuh Chen, Foster City, CA (US);

Inventors:

Stan D. Tsai, Fremont, CA (US);

Shou-Sung Chang, Los Altos, CA (US);

Liang-Yuh Chen, Foster City, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness greater than the first thickness and a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects at least 2 mil under an applied pressure of 1 psi or less.


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