The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
Aug. 24, 2005
Frank L. Hall, Boise, ID (US);
Todd O. Bolken, Star, ID (US);
Frank L. Hall, Boise, ID (US);
Todd O. Bolken, Star, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A method and apparatus for assembling and packaging semiconductor die assemblies utilizes a coating element such as a wafer back side laminate formed on a back side of a semiconductor die is disclosed. The coating element may be formed from a somewhat compressible and, optionally, resilient material, which seals against a surface of a mold cavity while the semiconductor die assembly is being encapsulated. In this manner, the coating element prevents encapsulant material from covering at least a portion of the back side of the semiconductor die to prevent encapsulant flashing over the back side and thus improve heat dissipation characteristics of the packaged semiconductor die during operation.