The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2009

Filed:

Aug. 27, 2003
Applicants:

David B. Smathers, Columbus, OH (US);

Frank S. Valent, Galloway, OH (US);

Michael J. Regan, Corvallis, OR (US);

Inventors:

David B. Smathers, Columbus, OH (US);

Frank S. Valent, Galloway, OH (US);

Michael J. Regan, Corvallis, OR (US);

Assignees:

Tosoh SMD, Inc., Grove City, OH (US);

Hewlett-Packard Company, Corvalis, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 35/587 (2006.01); B28B 1/00 (2006.01); B32B 13/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A composition and method for fabricating high-density Ta—Al—O, Ta—Si—N, and W—Si—N sputtering targets, having particular usefulness for the sputtering of heater layers for ink jet printers. Compositions in accordance with the invention comprise a metal component, SiN, and a sintering aid so that the targets will successfully sputter without cracking, etc. The components are combined in powder form and pressure consolidated under heated conditions for a time sufficient to form a consolidated blend having an actual density of greater that about 95% of the theoretical density. The consolidated blend may then be machined so as to provide the final desired target shape.


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