The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2009
Filed:
Apr. 06, 2006
Hamza Yilmaz, Saratoga, CA (US);
Qi Wang, Sandy, UT (US);
Minhua LI, Sandy, UT (US);
Chung-lin Wu, San Jose, CA (US);
Hamza Yilmaz, Saratoga, CA (US);
Qi Wang, Sandy, UT (US);
Minhua Li, Sandy, UT (US);
Chung-Lin Wu, San Jose, CA (US);
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
A method of bonding a semiconductor substrate to a metal substrate is disclosed. In some embodiments the method includes forming a semiconductor device in a semiconductor substrate, the semiconductor device comprising a first surface. The method further includes obtaining a metal substrate. The metal substrate is bonded to the first surface of the semiconductor device, wherein at least a portion of the metal substrate forms an electrical terminal for the semiconductor device.