The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2009

Filed:

Nov. 23, 2005
Applicants:

Hans Jansen, Eindhoven, NL;

Sebastiaan Maria Johannes Cornelissen, Eindhoven, NL;

Sjoerd Nicolaas Lambertus Donders, s-Hertogenbosch, NL;

Roelof Frederik DE Graaf, Veldhoven, NL;

Christiaan Alexander Hoogendam, Veldhoven, NL;

Hernes Jacobs, Eindhoven, NL;

Martinus Hendrikus Antonius Leenders, Rotterdam, NL;

Jeroen Johannes Sophia Maria Mertens, Duizel, NL;

Jan-gerard Cornelis Van Der Toorn, Eindhoven, NL;

Peter Smits, Baarlo, NL;

Franciscus Johannes Joseph Janssen, Eindhoven, NL;

Michel Riepen, Bergschenhoek, NL;

Bob Streefkerk, Tilburg, NL;

Inventors:

Hans Jansen, Eindhoven, NL;

Sebastiaan Maria Johannes Cornelissen, Eindhoven, NL;

Sjoerd Nicolaas Lambertus Donders, s-Hertogenbosch, NL;

Roelof Frederik De Graaf, Veldhoven, NL;

Christiaan Alexander Hoogendam, Veldhoven, NL;

Hernes Jacobs, Eindhoven, NL;

Martinus Hendrikus Antonius Leenders, Rotterdam, NL;

Jeroen Johannes Sophia Maria Mertens, Duizel, NL;

Jan-Gerard Cornelis Van Der Toorn, Eindhoven, NL;

Peter Smits, Baarlo, NL;

Franciscus Johannes Joseph Janssen, Eindhoven, NL;

Michel Riepen, Bergschenhoek, NL;

Bob Streefkerk, Tilburg, NL;

Assignee:

ASML Netherlands B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

In an immersion lithographic apparatus, bubble formation in immersion liquid is reduced or prevented by reducing a gap size or area on a substrate table and/or covering the gap.


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