The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2009

Filed:

Nov. 18, 2005
Applicants:

Ulrich Wegmann, Koenigsbronn, DE;

Helmut Haidner, Aalen, DE;

Inventors:

Ulrich Wegmann, Koenigsbronn, DE;

Helmut Haidner, Aalen, DE;

Assignee:

Carl Zeiss SMT AG, Oberkochen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 27/52 (2006.01); G03B 27/42 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a miniaturized device comprises disposing a patterning structure to be imaged in a region of an object plane of an imaging optics of the projection exposure system; disposing a substrate carrying a resist in a region of an image plane of the imaging optics and exposing portions of the substrate with images of the patterning structure using the projection exposure system; maintaining a flow of an immersion liquid to and from a space between the substrate and a front lens of the imaging optics closest to the substrate; measuring a physical property which is indicative of at least one of a refractive index of the immersion liquid and a change of the refractive index of the immersion liquid over time, wherein the physical property is measured using a beam of measuring light interacting with the immersion liquid; adjusting at least one optical property of the projection exposure system based on the measured physical property; exposing further portions of the substrate with images of the patterning structure using the projection exposure system with the at least one adjusted optical property of the projection exposure system; and developing the exposed resist and processing the substrate with the developed resist.


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