The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2009

Filed:

Nov. 22, 2005
Applicants:

Seng Guan Chow, Singapore, SG;

Ming Ying, Singapore, SG;

IL Kwon Shim, Singapore, SG;

Inventors:

Seng Guan Chow, Singapore, SG;

Ming Ying, Singapore, SG;

Il Kwon Shim, Singapore, SG;

Assignee:

Stats Chippac Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.


Find Patent Forward Citations

Loading…