The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
Mar. 09, 2006
Seng Guan Chow, Singapore, SG;
Ming Ying, Singapore, SG;
IL Kwon Shim, Singapore, SG;
Lip Seng Tan, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Ming Ying, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Lip Seng Tan, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.