The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Apr. 21, 2006
Chin-chiu Hsia, Taipei, TW;
Chih-hsiang Yao, Taipei, TW;
Tai-chun Huang, Hsin-Chu, TW;
Chih-tang Peng, Taipei, TW;
Chin-Chiu Hsia, Taipei, TW;
Chih-Hsiang Yao, Taipei, TW;
Tai-Chun Huang, Hsin-Chu, TW;
Chih-Tang Peng, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A bond pad structure of an integrated circuit is provided. The bond pad structure includes a conductive bond pad, a first dielectric layer underlying the bond pad, and an Mplate located in the first dielectric layer and underlying the bond pad. The Mplate is a solid conductive plate and is electrically coupled to the bond pad. The bond pad structure further includes a first passivation layer over the first dielectric layer wherein the first passivation layer has at least a portion under a middle portion of the bond pad. At least part of an active circuit is located under the bond pad.