The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Aug. 27, 2007
Leonel R. Arana, Phoenix, AZ (US);
Michael W. Newman, Chandler, AZ (US);
Je-young Chang, Phoenix, AZ (US);
Leonel R. Arana, Phoenix, AZ (US);
Michael W. Newman, Chandler, AZ (US);
Je-Young Chang, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A microelectronic package comprises a chip stack () that includes a substrate (), a first die () over the substrate and a second die () over the first die, a first underfill layer () between the substrate and the first die, and a second underfill layer () between the first die and the second die. The microelectronic package further comprises a fluidic microchannel system () in the chip stack, and the fluidic microchannel system comprises a fluid inlet () and a fluid outlet () connected to each other by a fluidic passage ().