The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2009
Filed:
Nov. 02, 2005
Isamu Asano, Tokyo, JP;
Natsuki Sato, Tokyo, JP;
Tyler A. Lowrey, Rochester Hills, MI (US);
Guy C. Wicker, Rochester Hills, MI (US);
Wolodymyr Czubatyj, Rochester Hills, MI (US);
Stephen J. Hudgens, Rochester Hills, MI (US);
Isamu Asano, Tokyo, JP;
Natsuki Sato, Tokyo, JP;
Tyler A. Lowrey, Rochester Hills, MI (US);
Guy C. Wicker, Rochester Hills, MI (US);
Wolodymyr Czubatyj, Rochester Hills, MI (US);
Stephen J. Hudgens, Rochester Hills, MI (US);
Elpida Memory, Inc., Tokyo, JP;
Abstract
A non-volatile memory element includes a first interlayer insulation layerhaving a first through-hole, a second interlayer insulation layerhaving a second through-holeformed on the first interlayer insulation layer, a bottom electrodeprovided in the first through-hole, recording layercontaining phase change material provided in the second through-hole, a top electrodeprovided on the second interlayer insulation layer, and a thin-film insulation layerformed between the bottom electrodeand the recording layer. In accordance with this invention, the diameter Dof a bottom electrodeburied in a first through-holeis smaller than the diameter Dof a second through-hole, thereby decreasing the thermal capacity of the bottom electrode. Therefore, when a poreis formed by dielectric breakdown in a thin-film insulation layerand the vicinity is used as a heating region, the amount of heat escaping to the bottom electrodeis decreased, resulting in higher heating efficiency.