The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2009
Filed:
Jul. 27, 2005
Kazuhito Matsukawa, Tokyo, JP;
Tsuyoshi Koga, Tokyo, JP;
Akio Nishida, Tokyo, JP;
Yoshiko Higashide, Tokyo, JP;
Jun Shibata, Tokyo, JP;
Hiroshi Tobimatsu, Tokyo, JP;
Kazuhito Matsukawa, Tokyo, JP;
Tsuyoshi Koga, Tokyo, JP;
Akio Nishida, Tokyo, JP;
Yoshiko Higashide, Tokyo, JP;
Jun Shibata, Tokyo, JP;
Hiroshi Tobimatsu, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
In a semiconductor chip A wherein an element layerhaving transistors and the like is formed on the front face, and the back face is joined to an underlying member, such as a package substrate, the thickness T is made 100 μm or less, and thereafter, a gettering layeris formed on the back face of the semiconductor chip A. The gettering layeris formed, for example, by polishing the back face of said semiconductor chip A using a polishing machine. Thereby, the yield of devices can be improved in the step for assembling the package.