The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Jun. 13, 2006
Yuichi Morita, Ora-gun, JP;
Shinzo Ishibe, Ora-Gun, JP;
Takashi Noma, Ota, JP;
Hisao Otsuka, Ora-Gun, JP;
Yukihiro Takao, Ota, JP;
Hiroshi Kanamori, Tokyo, JP;
Yuichi Morita, Ora-gun, JP;
Shinzo Ishibe, Ora-Gun, JP;
Takashi Noma, Ota, JP;
Hisao Otsuka, Ora-Gun, JP;
Yukihiro Takao, Ota, JP;
Hiroshi Kanamori, Tokyo, JP;
SANYO Electric Co., Ltd., Osaka, JP;
Abstract
The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film covering an end portion of the pad electrode and having a first opening on the pad electrode, a plating layer formed on the pad electrode in the first opening, a second passivation film covering an exposed portion of the pad electrode between an end portion of the first passivation film and the plating layer, covering an end portion of the plating layer, and having a second opening on the plating layer, and a conductive terminal formed on the plating layer in the second opening.