The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2009
Filed:
Jul. 02, 2007
Meng-jen Wang, Ping-Tung Hsien, TW;
Kuo-pin Yang, Kao-Hsiung Hsien, TW;
Wei-min Hsiao, Kao-Hsiung, TW;
Sheng-yang Peng, Kao-Hsiung, TW;
Meng-Jen Wang, Ping-Tung Hsien, TW;
Kuo-Pin Yang, Kao-Hsiung Hsien, TW;
Wei-Min Hsiao, Kao-Hsiung, TW;
Sheng-Yang Peng, Kao-Hsiung, TW;
Advanced Semiconductor Engineering, Inc., Kao-Hsiung, TW;
Abstract
A semiconductor packaging structure having electromagnetic shielding function is disclosed, in which the packaging structure includes a carrier and a semiconductor substrate disposed thereon. The semiconductor substrate has a patterned passivation layer and a patterned metal layer disposed thereon, in which the patterned metal layer is electrically connected to at least a grounding pad of the carrier via a wire, whereby possessing the semiconductor packaging structure to have electromagnetic shielding function. A method for manufacturing a semiconductor packaging structure having electromagnetic shielding function is also disclosed in the present invention.