The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2009
Filed:
Jul. 16, 2008
Anil Kumar Chinthakindi, Poughkeepsie, NY (US);
Douglas Duane Coolbaugh, Essex Junction, VT (US);
John Edward Florkey, Pleasant Valley, NY (US);
Jeffrey Peter Gambino, Westford, VT (US);
Zhong-xiang He, Essex Junction, VT (US);
Anthony Kendall Stamper, Williston, VT (US);
Kunal Vaed, Poughkeepsie, NY (US);
Anil Kumar Chinthakindi, Poughkeepsie, NY (US);
Douglas Duane Coolbaugh, Essex Junction, VT (US);
John Edward Florkey, Pleasant Valley, NY (US);
Jeffrey Peter Gambino, Westford, VT (US);
Zhong-Xiang He, Essex Junction, VT (US);
Anthony Kendall Stamper, Williston, VT (US);
Kunal Vaed, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor structure. The semiconductor structure includes: a substrate having a metal wiring level within the substrate; a capping layer on and above the substrate; an insulative layer on and above the capping layer; a first layer of photo-imagable material on and above the insulative layer; a layer of oxide on and above the first layer of photo-imagable material; a second layer of photo-imagable material on and above the layer of oxide; an inductor; and a wire bond pad. A first portion of the inductor is in the second layer of photo-imagable material, the layer of oxide, the first layer of photo-imagable material, the insulative layer, and the capping layer. A second portion of the inductor is in only the second layer of photo-imagable material. The wire bond pad in only the first layer of photo-imagable material, the insulative layer, and the capping layer.