The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7565925 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 28, 2009

Filed:

Jun. 24, 2005
Applicants:

Hsieh-kun Lee, Fullerton, CA (US);

Cheng-tien Lai, Fullerton, CA (US);

Zhi-bin Tan, Fullerton, CA (US);

Inventors:

Hsieh-Kun Lee, Fullerton, CA (US);

Cheng-Tien Lai, Fullerton, CA (US);

Zhi-Bin Tan, Fullerton, CA (US);

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device includes a heat sink () and at least a serpent heat pipe (). The heat sink () comprises a base () contacting with an electrical component, a heat dissipation fins group () secured to the base () and a cover () attached to a top of the heat dissipation fins group (). The heat dissipating fins group () defines a notch () at one side thereof. Two end portions of the heat pipe () are respectively connected to the base () and the cover (), and a middle portion of the heat pipe () is accommodated in the notch ().


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Lee, Hsieh-Kun. (2009). Heat dissipation device (U.S. Patent No. 7565925). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7565925

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