The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2009

Filed:

Jul. 14, 2005
Applicants:

Norihiko Ikeda, Chuo-ku, JP;

Kazuo Nishimoto, Chuo-ku, JP;

Masayuki Hattori, Chuo-ku, JP;

Nobuo Kawahashi, Chuo-ku, JP;

Inventors:

Norihiko Ikeda, Chuo-ku, JP;

Kazuo Nishimoto, Chuo-ku, JP;

Masayuki Hattori, Chuo-ku, JP;

Nobuo Kawahashi, Chuo-ku, JP;

Assignee:

JSR Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09G 1/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chemical mechanical polishing aqueous dispersion comprises abrasives in a concentration of not more than 1.5% by mass, wherein the abrasives comprise ceria and have an average dispersed particle diameter of not less than 1.0 μm. A chemical mechanical polishing method comprises polishing an insulating film by the use of the chemical mechanical polishing aqueous dispersion. By the use of the chemical mechanical polishing aqueous dispersion, occurrence of polishing scratches can be suppressed without lowering a removal rate.


Find Patent Forward Citations

Loading…