The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
Sep. 11, 2006
Sheila Rima C. Magno, Singapore, SG;
Byung Tai DO, Singapore, SG;
Dennis Guillermo, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Sheila Rima C. Magno, Singapore, SG;
Byung Tai Do, Singapore, SG;
Dennis Guillermo, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied on the die at the conductive wires for preventing wire sweep and the sealant is free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are encapsulated in an encapsulant.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile