The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
Sep. 11, 2006
Applicants:
Sheila Rima C. Magno, Singapore, SG;
Byung Tai DO, Singapore, SG;
Dennis Guillermo, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Inventors:
Sheila Rima C. Magno, Singapore, SG;
Byung Tai Do, Singapore, SG;
Dennis Guillermo, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied on the die at the conductive wires for preventing wire sweep and the sealant is free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are encapsulated in an encapsulant.